Cutting of window or lens cover of brittle and transparent material as strengthen glass or sapphire.
Micro fabrication of metal pieces that require fine feature, high process control and no heat generation. Include surface structuring.
Scribing of sapphire and other substrates with benefits including scribing and full-cut dicing. Thin Film removal for OLED production.
Micro-processing of semiconductor (Silicon) wafers. Inspection of masks.